2 Pack 10g (20g in Total) HY910 0.975W/m-k Thermal Conductive Glue, High-Performance Thermal Plaster, Silicone Viscous Adhesive Cooling Compound, Heatsink Glue for LED GPU MOSFET 3D Printer IC Chipset

Price: AED 60.51
(as of Jan 27,2024 11:56:23 UTC – Details)

2 Pack 10g (20g in Total) HY910 0.975W/m-k Thermal Conductive Glue, High-Performance Thermal Plaster, Silicone Viscous Adhesive Cooling Compound, Heatsink Glue for LED GPU MOSFET 3D Printer IC Chipset

Specifications:
Material: Silicone viscous adhesive
Thermal Conductivity: >0.975 W/m-k
Weight: 10g per pack, 20g in total
Color: White
Application: MOSFET, LED, heatsinks, North-south bridge, video card, chipset, electrical appliances, instruments, 3D printers and all electronic components that require direct bonding
Operating Temperature: -60°C to 250°C
Storage Temperature: 10°C to 30°C
Shelf-life: 6 months

Features:
The 2 Pack 10g (20g in Total) HY910 0.975W/m-k Thermal Conductive Glue is a high-performance thermal plaster that is designed to provide excellent thermal conductivity and adhesion for electronic components. It is ideal for use with MOSFET, LED, heatsinks, North-south bridge, video card, chipset, electrical appliances, instruments, 3D printers and all electronic components that require direct bonding.
This thermal glue has a thermal conductivity rating of >0.975 W/m-k and is capable of dissipating heat effectively, ensuring that your device operates efficiently and prolongs its lifespan. It has a wide service temperature range of -60°C to 250°C, making it suitable for use in a wide range of environments.
The package contains 2 tubes of 10g each, totaling 20g of thermal glue. It has a white color and is easy to apply with its silicone viscous adhesive texture. Once opened, it should be used within 24 hours to ensure optimal performance. It has a strength of connected buildings of 55 lb and is ideal for all heatsinks without fixed clip thermal paste.
Overall, the 2 Pack 10g (20g in Total) HY910 0.975W/m-k Thermal Conductive Glue is an excellent choice for anyone looking to enhance the cooling performance of their electronic components, ensuring optimal functionality an
Safe and Non-Toxic – This thermal adhesive is non-electrical conductive, safe, and non-toxic, making it safe for both users and electronic components. It is odorless, moisture-resistant, and non-swelling, ensuring that it does not damage the substrate over time. Important: it is important to note that this thermal glue should not be used between the CPU and heatsink.
Strong Adhesion – This thermal plaster features strong adhesion properties that allow it to bond with most metals and non-metals, ensuring a reliable and long-lasting connection. The strength of the connected buildings is 55 lb, making it a high-performance option that delivers excellent results.
Quick Drying Time – This thermal adhesive cures quickly upon contact with air, with a drying time of approximately 30 minutes at 25℃. This makes it easy and convenient to apply, with minimal downtime required.
Wide Service Temperature Range – With a service temperature range of -60~250 degrees Celsius, this thermal adhesive is suitable for use in a wide range of industries and applications. It has good thermal conductivity and stability, and is ideal for use in electrical appliances, instruments, and other industries that require effective heat dissipation.